2022-02-22 22:08:49 +01:00

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(kicad_pcb (version 20211014) (generator pcbnew)
(general
(thickness 1.6)
)
(paper "A4")
(layers
(0 "F.Cu" signal)
(31 "B.Cu" signal)
(32 "B.Adhes" user "B.Adhesive")
(33 "F.Adhes" user "F.Adhesive")
(34 "B.Paste" user)
(35 "F.Paste" user)
(36 "B.SilkS" user "B.Silkscreen")
(37 "F.SilkS" user "F.Silkscreen")
(38 "B.Mask" user)
(39 "F.Mask" user)
(40 "Dwgs.User" user "User.Drawings")
(41 "Cmts.User" user "User.Comments")
(42 "Eco1.User" user "User.Eco1")
(43 "Eco2.User" user "User.Eco2")
(44 "Edge.Cuts" user)
(45 "Margin" user)
(46 "B.CrtYd" user "B.Courtyard")
(47 "F.CrtYd" user "F.Courtyard")
(48 "B.Fab" user)
(49 "F.Fab" user)
)
(setup
(stackup
(layer "F.SilkS" (type "Top Silk Screen"))
(layer "F.Paste" (type "Top Solder Paste"))
(layer "F.Mask" (type "Top Solder Mask") (thickness 0.01))
(layer "F.Cu" (type "copper") (thickness 0.035))
(layer "dielectric 1" (type "core") (thickness 1.51) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
(layer "B.Cu" (type "copper") (thickness 0.035))
(layer "B.Mask" (type "Bottom Solder Mask") (thickness 0.01))
(layer "B.Paste" (type "Bottom Solder Paste"))
(layer "B.SilkS" (type "Bottom Silk Screen"))
(copper_finish "None")
(dielectric_constraints no)
)
(pad_to_mask_clearance 0.2)
(grid_origin 55.08 144.93)
(pcbplotparams
(layerselection 0x0000030_ffffffff)
(disableapertmacros false)
(usegerberextensions false)
(usegerberattributes false)
(usegerberadvancedattributes false)
(creategerberjobfile false)
(svguseinch false)
(svgprecision 6)
(excludeedgelayer true)
(plotframeref false)
(viasonmask false)
(mode 1)
(useauxorigin false)
(hpglpennumber 1)
(hpglpenspeed 20)
(hpglpendiameter 15.000000)
(dxfpolygonmode true)
(dxfimperialunits true)
(dxfusepcbnewfont true)
(psnegative false)
(psa4output false)
(plotreference true)
(plotvalue true)
(plotinvisibletext false)
(sketchpadsonfab false)
(subtractmaskfromsilk false)
(outputformat 1)
(mirror false)
(drillshape 0)
(scaleselection 1)
(outputdirectory "")
)
)
(net 0 "")
)